Upcoming Webinars
Understanding Thermal Gap Filler Pads, PCB Deflection, and Stress
Presented by Christian Miraglia, Applications Engineering Manager
Date: June 16th
Time: 1 PM EDT (10 AM PDT / 7:00 PM CEST)
Duration: 1 Hour
Register for this webinar to learn the compression characteristics of gap filler materials and PCBs, and how they impact the overall deflection and stress in an electronic assembly.
Overview
Thermal gap filler pads are regularly used for transferring heat from high power components to heat sinks and spreaders. As thermal conductivity increases so does the increase in modulus. The ever-increasing heat flux continues to drive the need for higher performing gap filler increase.
Join this webinar to discover the compression characteristics of thermal gap filler pads, with an applied understanding to a PCB assembly. Attendees will have a better understanding of what basic analytical techniques and tests can be performed to understand stress as well as defection in both gap filler pads and PCB.
Key Takeaways
- Understand the impact of compression on PCBs
- Discover the impact of compression of gap fillers on PCB deflection
- Become familiar methods to test for board deflection
- Learn a basic analytical approach to understanding board and gap filler pad deflection
Past Webinars
THERMAL LIVE 2019 - Understanding Thermal Gap Filler Pads, PCB Deflection, and Stress
Presented by Christian Miraglia, Applications Engineering Manager
Managing compression force and stress is critical in any application that incorporates gap filler pads as a thermal interface. In this webinar, we will look at the compression characteristics of thermal gap filler pads. We will apply this understanding to a PCB assembly. Webinar attendees will have a better understanding of the basic analytical techniques and tests that can be performed to understand stress as well as defection in both gap filler pads and PCB.
Fujipoly February 2019 Webinar - Advantages of Putty Type Gap Fillers Webinar
Presented by Christian Mainegra, Sales Engineer
The need for low compression force Thermal Gap Fillers continues to become more prevalent. Tolerance variations drive the need for compliant Thermal Gap Filler Materials. To satisfy these market requirements, Fujipoly® offers an extensive line of compressible Putty Gap Filler Materials. Our expertise in silicone formulation makes us the market leader in high-performance Putty Type Thermal Gap Fillers.
Key Topics Include:
- What is a Putty vs. a standard Gap Filler
- Comparisons of stress strain of Putties vs. Standard Gap Fillers
- Advantages of Putty over dispensable Gap Fillers
- Handling/Application Notes
Thermal Live 2018 Webinar - Fundamentals of Heat Transfer in Thermal Interface Gap Filler Materials
Presented by Applications Engineer Christian Miraglia
Thermal Live 2017 Webinar - Compression Characteristics of Thermal Interface Gap Fillers Materials
Presented by Applications Engineer Christian Miraglia
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