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Announcements

Rugged, Low-Resistance Silver Connector

Rugged, Low-Resistance Silver Connector

  • Posted: 28 October, 2015

The Fujipoly Series 5002 Silver Zebra® connector is an excellent low-cost, long-life option for LCD to printed circuit board connections.  It is also a great choice as a board to board connector where space is limited.

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5.0 W/m°K FIP Thermal Compound

5.0 W/m°K FIP Thermal Compound

  • Posted: 28 September, 2015

SARCON® SPG-50A from Fujipoly® is among the industry's highest performance form-in-place gap filler compounds.

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Cooling for LEDs

Cooling for LEDs

  • Posted: 25 August, 2015

LED lighting has made a profound impact on the functionality and appearance of millions of consumer and commercial products. One of the most challenging issues when using LEDs is thermal dissipation. These lighting packages typically generate a significant amount of heat.

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ECU and Embedded Systems Cooling

ECU and Embedded Systems Cooling

  • Posted: 20 July, 2015

Electronic Control Units (ECUs) are the brains of modern vehicles. As engineers push the limits of performance, safety and passenger comfort they can pack nearly 100 embedded systems into a single, mobile platform.

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And the Winner Is…

And the Winner Is…

  • Posted: 16 June, 2015

Over the last several weeks, hundreds of engineers and industry professionals entered Fujipoly’s Great Gift Giveaway by filling out an online entry form that asked participants to simply name one of the Company’s products.

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Great Support

Great Support

  • Posted: 27 May, 2015

Fujipoly’s Self-Supporting Sponge Connectors are ideal for connecting LCD panels to circuit boards with a very low deflection force.

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Fujipoly’s® 2015 Amazing Gift Giveaway

Fujipoly’s® 2015 Amazing Gift Giveaway

  • Posted: 16 April, 2015

On June 5th one lucky engineer will have the pleasure of selecting a free Samsung Galaxy Tab® Pro, Apple iPhone 6 or $500 American Express gift card by simply naming one Fujipoly® thermal interface material or elastomeric connector product!  Due to the

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Thin Bond Line Thermal Interface Material

Thin Bond Line Thermal Interface Material

  • Posted: 17 March, 2015

Sarcon® SG-26SL is an easy-to-apply, thermally conductive and electrically non-conductive silicone-based compound that exhibits a low thermal resistance.When dispensed between a component such as a CPU or power converter and a heat sink, this material delivers

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Fujipoly® Announces New Sales Partnership

  • Posted: 10 March, 2015

Fujipoly® announces a new partnership with Rathsburg Associates headquartered in Novi, Michigan.  The fifteen state technical sales group will help Fujipoly® grow its rapidly expanding footprint in the north central portion of the United States.

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Built-In Advantages

Built-In Advantages

  • Posted: 17 February, 2015

Fujipoly’s Sarcon® 250G-HF2d thermal interface material is manufactured with a reinforced nylon mesh inner layer as well as a low-tac surface treatment.

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