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SPG-15A

UL FILE NUMBER: E58126

RELIABILITY:

Thermal resistance under heat, cold, humid and thermal shock conditions.

 

+150?C Aging    
GapsInitial100hrs250hrs500hrs1,000hrs
1.0mm 0.6 0.6 0.6 0.6 0.6
2.0mm 1.1 1.1 1.2 1.2 1.2
3.0mm 1.6 1.9 1.9 1.9 1.9
-40?C Aging     
GapsInitial100hrs250hrs500hrs1,000hrs
1.0mm 0.6 0.6 0.6 0.6 0.6
2.0mm 1.1 1.1 1.1 1.1 1.1
3.0mm 1.6 1.6 1.6 1.6 1.6
+60?C 95%RH Aging   
GapsInitial100hrs250hrs500hrs1,000hrs
1.0mm 0.6 0.6 0.6 0.6 0.6
2.0mm 1.1 1.1 1.2 1.2 1.2
3.0mm 1.6 1.9 1.9 1.9 1.9
-40?C to +125?C Heat Shock   
GapsInitial100hrs250hrs500hrs1,000hrs
1.0mm 0.6 0.6 0.6 0.6 0.6
2.0mm 1.1 1.2 1.3 1.3 1.3
3.0mm 1.6 2.0 2.0 2.0 2.0

Unit of Thermal Resistance: ?C•in2/W based on ASTM D5470 Test Method.
Contact Surface: 3.14cm2 (0.49in2)
Filled SPG1-A material’s weight: 1.0mm - 09.g; 2.0mm - 1.8g; 3.0mm - 2.6g

Viscosity under heat, cold, humid and thermal shock conditions.

Test ConditionsUnitInitial1,000 hrs later
+150?C Aging Pa•s* 2,000 3,100
-40?C Aging 2,000 2,000
+60?C 95%RH Aging 2,000 2,000
-40?C to +125?C Heat Shock 2,000 2,200

*Accurate Rotary Viscometer (RV1)

Technical Documents Available!

SARCON® SPG-15A is a highly conformable/thermally conductive, high viscosity type silicone compound. It provides a thermal solution for the recent trends of integrating higher frequency electronics into smaller devices. SARCON® SPG-15A easily forms and adheres to most surfaces, shapes, and sizes of components.

SARCON® SPG-15A makes complete and reliable physical contact with the component and opposing surfaces. It provides handling properties that are superior to thermal grease & potting materials.

  • Thermal transfer from heatgenerating device to heat spreader or heat sink.

FEATURES:

  • Fill large gaps while providing superior thermal transfer.
  • Conformable with very low compression forces.
  • Excellent vibration absorption capabilities.
  • Maintains all initial properties across a wide temperature range.
  • Used to "Form-In-Place" and remain form stable.
  • Requires no heat curing.
  • Will not cause corrosion on any metal surface.

SPECIFICATIONS:

PropertyUnitSPG-15AMethod
Specific Gravity 2.8 ASTM D792
Viscosity Pa•s 2,000 Fujipoly
Flow Rate cc/min 8 Fujipoly
Thermal Conductivity Watt/m•K 1.5 Fujipoly
Volume Resistivity MΩ-m 1 x 106 ASTM D257
Breakdown Voltage kV/mm 10 ASTM D149
Withstand Voltage kV/mm 8 ASTM D149
TGA Weight Loss wt% 0.10 After +150?C,
24hrs aging
Operating Temp. Range ?C -40 to +150 Recommended
Thermal Resistance ?C•in2/W 0.6 at 1.0mm gap ASTM D5470
Compression
Load/Modulus
N Peak 19.6 Fujipoly
Sustain 1.0

PRODUCT CONSTRUCTION:

PART NUMBER NOMENCLATURE: