- ZEBRA® Elastomeric Connectors
- SARCON® Thermal Management Components
- Fusible Tapes
- Custom Silicone Rubber Extrusions
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The chart below contains link to all Low Compression Force Gap Filler products. Select a part to view details.
|SARCON ®||Type||Application Guidelines||Typical Thermal Conductivity|
|Cal/cm - sec - °C||Watt/m•K|
|SARCON ® GR-Sd||Low Compression
Force Gap Filler
|Low modulus gap filler material||3.4 x 10-3||1.50|
|SARCON ® GR-SL||Lowest modulus gap filler material||6.5 x 10-3||2.70|
UL FILE NUMBER: E58126
SARCON® GR-Sd and GR-SL are two of the lowest modulus type of Thermal Gap Filler Pad material available. Ideally suited for applications requiring low compression force on the component. It offers the high performance of the original GR-d and GR-L materials in a versatile sheet form that very easily conforms in and around protrusions and depressions on components to make complete, reliable physical contact.