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Gold 8000 Connectors

Technical Documents Available!
The FUJIPOLY ZEBRA® Series 8000 elastomeric connector elements are D-shaped, low durometer silicone elastomer cores around which flat metallic gold-plated conductors are vulcanized in a row parallel to each other. The tips of the metallic conductors are turned upward so that point contact can be effected; in addition, contact is made to the flat area when the connector element is positioned between two printed circuit boards. The point contact will penetrate surface oxides or contaminants which might be present on the surface of the contact pads, thus assuring reliable electrical connection on two planes. Also available are standard board to board assemblies which include connector and holder.

Dimensional Specifications

Connector Dimensions*MinimumMaximum
Length = L 5.08mm ± 0.127mm 152.4mm ± 0.762mm
Height = H 2.54mm ± 0.127mm 12.70mm ± 0.381mm
Width = W 1.52mm ± 0.127mm 3.18mm ± 0.254mm

* Note: For good design practice and low deflection force requirements, the height “H” should be twice the width “W”. For other sizes consult factory.

Materials

Connector ComponentMaterials Used
Conductive Elements Gold-plated copper wire. gold 0.00025mm, nickel 0.0013mm.
Wire Size and Spacing
(Series 8000 A,B and C)
A. 0.05mm x 0.127mm flat wire on 0.25mm center-to-center spacing. (Min. 100 wires/ inch.)
B. 0.05mm x 0.10mm flat wire on 0.19mm center-to-center spacing. (Min. 133 wires/inch.)
C. 0.025mm x 0.076mm flat wire on 0.15mm center-to-center spacing. (Min. 166 wires/inch.)
 
Connector body Non-conductive tan color silicone rubber. UL-94-HB rating, 500 volts/mil dielectric strength.
Film 0.025mm thick polyamide dielectric strength of film ASTM-D-149, 2000 volts/mil. 

Performance Characteristics

ParameterConditions and Performance
Contact Resistance Less than 25 milliohms on 0.025” wide contact pads; 0.100 amperes DC, Kelvin- type four probe test method
Insulation Resistance Minimum 1012 ohms between adjacent conductive elements.
Current Carrying Capacity Series 8000 A and B, 500 mA per wire max.; Series 8000 C, 250 mA per wire max.
Capacitance Maximum 0.100 picofarads per adjacent pad at 1 MHz and 0.100” high (“H”).
Inductance Maximum 7 nanohenries per adjacent pad at 1 MHz and 0.100” high (“H”).
Repeated Actuations 500 actuations without appreciable change in contact resistance (deflection of 15%).
Deflection 8% to 20%. Recommended deflection 10 to 15% of original height.
Deflection Force/Inch 4lbs. per linear inch for 15% deflection for a 0.062” (“W”) x 0.285 (“H”) connector.
Operating Temperature Range -20° C min., 125° C max.
Salt Spray Test MIL-STD-202E, method 101D, condition B. 5% salt solution 95° F, 48 hours. There was no evidence of blistering or peeling of the contact material.
Temperature Cycling MIL-STD-202E, method 102A, condition D, -55° C, 25° C, 125° C. There was no change in the physical properties of the specimens.
Humidity (Steady State) MIL-STD-202E, method 103B, condition C modified. 95% RH room temperature. There was no appreciable change in contact resistance after 500 hours exposure.
Corrosive Environment 1,000 hours exposure at 1 ppm H2S and 1 ppm O2, 60° C AND 75% RH. Slight change in contact resistance; no evidence of contact peeling or blistering.