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|ASPECT RATIO (AR)||Ratio of ZEBRA® connector height to width. (Aspect ratio of 1.5 and higher is recommended to minimize the
amount of force required to deflect the ZEBRA® connector.)
|BEZEL||Positioning device designed to surround the LCD edges while applying force to the ZEBRA® connector. Usually
the decorative portion of the connector package. Plastic or metal cover placed over the LCD.
|BRIDGE||Rib section on a ZEBRA® connector holder serving to reinforce the holder as well as minimize the length of
individual ZEBRA® connection spans.
|COMPRESSION SET||Amount by which a compressed ZEBRA® connector will not recover to its original height when compression is
removed within the prescribed deflection limits. (typical maximum of 25%)
|CONNECTOR PITCH||Center-to-center measurement of conductive layers.|
|CONTACT DENSITY||Number of conductive layers per inch.|
|DEFLECTION||Difference in original height versus compressed height of connector|
|GAP||Space on a PC board or LCD which does not contain contact pads.|
|HOLDER / RETAINER||Positioning device used to contain the ZEBRA® connector to assure proper alignment between two mating
|LCD PITCH AND/OR PC BOARD PITCH||Centerline-to-centerline distance between contact pads.|
|LIP WIDTH||Distance from outside edge of front glass to edge of back glass.|
|PAD WIDTH||Distance measured edge-to-edge of contact pad (CW).|
|PAD LENGTH||Distance measured end-to-end of contact pad (CL).|
|PAD MATERIALS||LCD contact pads are normally indium tin oxide. PC board contact pads may be gold, carbon-coated or soldercoated.
Plating methods can result in significant variations in contact pad thickness, but should be kept as flat as
|REGISTRATION||Vertical alignment of contact pads between two mating surfaces.|
|SEPARATION||Distance between two mating surfaces.|
|STRESS RELAXATION||The function which relates to the loss of back stress of the compressed connector over time. Expressed as a
percent of original stress.
|TOLERANCE STACK-UP||Minimum and maximum dimensions of separation between LCD contacts and PC board contacts as determined
by consideration of tolerance variations in flatness and parallelism of components.